Low-temperature hot melt adhesives, with a thermal degradation temperature between 120℃ and 140℃, offer higher safety and stability compared to medium-temperature and ordinary hot melt adhesives. They also reduce odor and make heat sealing time easier to control.
The Impact of Thermal Degradation on Odor
As the thermal degradation temperature of hot melt adhesives increases, the odor also intensifies. Using low-temperature hot melt adhesives, with a thermal degradation temperature between 120℃ and 140℃, significantly reduces hot melt adhesive fumes and volatile matter, effectively minimizing odor.
Aging Comparison of Low-Temperature Hot Melt Adhesives and Traditional Hot Melt Adhesives
Besides affecting odor, thermal degradation of hot melt adhesives also leads to aging. At high temperatures, the aging rate of hot melt adhesives accelerates, affecting their performance. Low-temperature hot melt adhesives, with their lower thermal degradation temperature, exhibit more stable characteristics during aging, effectively slowing down the aging process.
After comparing the aging results of Henkel's low-temperature hot melt adhesive and traditional hot melt adhesives at their respective application temperatures for 300 hours, we found that Henkel's low-temperature adhesive remained pure, while traditional hot melt adhesives from other companies appeared more cloudy under the same conditions. This result highlights the advantage of low-temperature hot melt adhesives in terms of aging stability.