The principle of low-temperature hot melt adhesives for diapers is to optimize the formulation and process, allowing the adhesive to melt and be coated at a lower temperature (typically 120℃~160℃). This effectively bonds materials while avoiding high-temperature damage to the film, reducing energy consumption, and minimizing the release of harmful volatile organic compounds.
Unlike traditional hot melt adhesives that require melting above 180℃, low-temperature hot melt adhesives achieve performance breakthroughs through the following technical pathways:
Formulation Improvement: Using specially modified thermoplastic elastomers (such as SEBS, SIS) and low-softening-point tackifying resins, combined with high-efficiency plasticizers and stabilizers, significantly lowers the melting temperature. These formulations maintain good flowability and adhesive strength within the 120℃~160℃ range.
Protecting Sensitive Materials: The PE bottom film in diapers is thin and has poor heat resistance, easily leading to deformation or perforation at high temperatures. Low-temperature hot melt adhesives avoid heat damage to the PE film, enabling the use of lighter, thinner, and more environmentally friendly packaging materials.
Enhancing Production Safety and Environmental Friendliness: Low-temperature operation reduces fumes and volatile organic compounds (VOCs) generated by the thermal decomposition of colloids, improving the workshop environment, reducing worker health risks, and complying with increasingly stringent environmental regulations.
Energy Saving and Consumption Reduction: Energy consumption can be reduced by approximately 8% to 12% for every 10°C decrease in heating temperature. Low-temperature hot melt adhesives significantly reduce energy consumption on production lines, helping companies achieve green manufacturing.