Product Description
Maintaining the structural stability of the absorbent layer is paramount, and our Absorbent Core Integrity Bonding Compound (Model 2100) is the definitive solution for high-performance cores. We have designed this Absorbent Core Integrity Bonding Compound to address the common industry problem of "clumping" or "breaking" when the core becomes saturated. By providing a high wet-strength bond that remains effective even after liquid absorption, our Absorbent Core Integrity Bonding Compound ensures that the fluff pulp and SAP remain evenly distributed, preventing leakage and maintaining a slim profile for the user.
Our source factory utilizes advanced reaction vessels and automated packaging lines to produce this Absorbent Core Integrity Bonding Compound with unmatched consistency. We focus on a "soft-feel" formula that ensures the core remains flexible and does not become stiff or abrasive against the skin after the adhesive cures. Every batch of the Absorbent Core Integrity Bonding Compound is tested using our internal tensile testing machines and ovens to simulate real-world usage conditions. With 28 years of history, we provide the technical security you need to produce ultra-thin, high-absorbency napkins that stand out in the global hygiene market.
Technical Specifications
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Wet Strength Retention |
≥70% after liquid immersion. |
|
Texture |
Soft modulus for enhanced comfort. |
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Viscosity |
Optimized for penetration into core materials without bleed-through. |
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Safety |
Non-toxic, allergen-free, and compliant with HG/T 3948-2025. |
Application Areas
Used for internal composite bonding of absorbent cores, securing dust-free paper, air-laid paper, and SAP lamination in napkins and diapers.
Customization Capability
Packaging & Shipping
Export-grade 1-ton plastic pallets with moisture-proof wrapping. We support FOB, EXW, and DDP shipping with delivery in 1–3 weeks for standard orders.
FAQ
Q: Does this glue inhibit SAP absorption?
A: No, the formula is non-filming to ensure it does not block the liquid distribution.
Q: Is it suitable for ultra-thin pads?
A: Yes, it is the primary choice for bonding compressed air-laid cores.
Q: What currencies do you accept?
A: We accept payments in USD.
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